New Flex solutions enable cloud service providers to address power, heat, and scale challenges in the AI era
News summary
- Flex launches new compute, rack, and intermediate bus converter products for AI data centers
- Flex and JetCool® partner for direct-to-chip liquid cooling
- Flex’s ORv3-compatible rack integrated with single-phase liquid cooling, enabled for two-phase liquid cooling
, /PRNewswire/ — OCP Global Summit — Flex (NASDAQ: FLEX) today announced new reference platforms for liquid-cooled servers, rack, and power products that will enable customers to sustainably accelerate data center growth. These innovations build on Flex’s ability to address technical challenges associated with power, heat generation, and scale to support artificial intelligence (AI) and high-performance computing (HPC) workloads.
“Flex delivers integrated data center IT and power infrastructure solutions that address the growing power and compute demands in the AI era,” said Michael Hartung, president and chief commercial officer, Flex. “We are expanding our unique portfolio of advanced manufacturing capabilities, innovative products, and lifecycle services, enabling customers …